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Decades of experience in the development of plastic fittings, housings and other components

HSV TMP The development and production of large thick-walled bottoms for roll containers
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Big thick-walled bottom for roll container

Market: Logistics Technique: Structural foam moulding Material: HDPE recyclate Particulars: The development and production of large thick-walled bottoms for roll containers(thicknesses up to 12mm). Sharp tolerance (+1mm-+2mm). These bottoms are fully sustainable, and produced from […]

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Complex housing

DASHBOARD FOR STEAMROLLER

Market: infrastructure Technique: SF + painting Material: PS V0 Particulars: Complex housing with lots of details, complex interior and perfect exterior in one product thanks to SF technique  

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HSV Technical Moulded Parts developes and produces DASHDASHBOARD FOR STEAMROLLER
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Complex housing

DASHDASHBOARD FOR STEAMROLLER

Market: infrastructure Technique: SF + painting Material: PS V0 Particulars: Complex housing with lots of details, complex interior and perfect exterior in one product thanks to SF technique

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HSV Technical Moulded Parts developes and produces a Lightweight cable duct
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Lightweight cable duct

RAILWAY CABLE DUCT

Market: infrastructure Technique: injection moulding Material: PA-V2 Particulars: Lightweight cable duct with fire-resistant properties

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HSV Technical Moulded Parts, Large tunnel loudspeaker consisting of 2 glued parts
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Large tunnel loudspeaker

TUNNEL LOUDSPEAKER

Market: infrastructure Technique: SF unpainted Material: PA-V0 Particulars: Large tunnel loudspeaker consisting of 2 glued parts

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HSV TMP is specialized in developing and manufacturing of plastic housings for the electronic industry
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Fibre optic distribution

FIBRE OPTIC DISTRIBUTION BOX

Market: infrastructure/electronics Technique: SF Material: PC-ABS Particulars: high-quality, dimensionally accurate housing for fibre optic distribution  

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HSV Technical Moulded Parts, Complex interior for installation of electronics, combined with perfectly painted exterior
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Complex interior

HOUSING CHIPCARD-UPGRADE

Market: infrastructure Technique: SF + painting Material: PC-ASA V0 Particulars: Complex interior for installation of electronics, combined with perfectly painted exterior

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